Rochester offers a full range of assembly services including Open Cavity Packages (OCPs) Hermetic assembly, Plastic Assembly, component lead finishing, package, substrate, and leadframe replication, providing single solutions through to full turnkey manufacturing.

 

 

Rochester Electronics has significant expertise in stress testing which enables our customers to accelerate potential failure mechanisms, help identify root cause and take actions to prevent failure mode. Our in-house equipment includes thermal, mechanical, moisture and bond testing for a wide variety of tests.