Mitigating Supply Chain Risks: On-Shore Assembly Solutions for Long-Lifecycle Systems
With the growing instability of overseas semiconductor supply chains, domestic manufacturing solutions provide a secure and steady alternative. Join our technical experts to learn about the current state of the market, technical capabilities, and infrastructure investments for customizable onshore assembly and testing to mitigate supply chain risks.
Date: Tuesday, April 9, 2024 Time: 11:00 AM ET / 4:00 PM BST
There are many pieces to any semiconductor product “puzzle” that can result in obsolescence. These pieces range from business revenue to any one of the subcomponents that compose semiconductor products, such as foundry process technologies, packages, substrate or lead frames, test platforms, or design resources. Learn how Rochester has invested in onshore assemblies to provide continued long-term support.
THE MANUFACTURING MOVE TOWARDS QFN AND DFN ASSEMBLIES
As the market shifts towards substrate BGA, QFN, and DFN assemblies, the future of SOIC and low pin-count PLCCs will be significantly impacted. Rochester's investment in QFN/DFN assemblies ensures continued support for long-term system companies and flexibility, with footprint compatibility and minor board changes. Learn how we are solving another component of the obsolescence puzzle for our global customers.
